材料特点：

1.无铅中Tg材料  

2.材料Tg≥150。C(DSC),Td≥340°C  

3.与FR-4制造工艺兼容  

4.低Z-CTE及高耐热信赖性,良好的抗CAF能力  

Material Characteristics

1.Middle Tg material lead-free

2.Material TG≥150。C (DSC), TD≥340 °C

3.Compatible with FR- 4 manufacturing process

4.Low Z-CTE and high heat-resistant reliability,excellent CAF resistance

产品应用：

汽车板、个人电脑、笔记本、游戏设备、网路通信设备、厚铜产品等  

对等材料:1X-X58\XM825\X1000H 

Product Application

Automobile board, personal computer, notebook, gameequipment, network communication equipment, thickcopper products, etC

Equivalent material: IX-X58\)XM825\X1000H