材料特点：

1.无铅高Tg材料  

2.材料Tg≥170°C(DSC),Td≥352。C  

3.与FR-4制造工艺兼容  

4.更低Z-CTE及高耐热信赖性,良好的抗CAF能力 

Material Characteristics

1.Lead free high Tg material

2.TG≥170 °C (DSC),TD≥352。C

3.Compatible with FR- 4 manufacturing process

4.Lower Z-CTE and high heat-resistant reliability,

excellent CAF resistance

产品应用：

高多层板、背板、服务器、网络通讯  

对等材料:IX-X8XX. 

Product Application

High multi-layer board, backplane, server, network

communication

Equivalent material: |X-X8XX